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1. product profile 1.1 general description npn resistor-equipped transistor (ret) in a leadless ultra small dfn1006b-3 (sot883b) surface-mounted device (smd) plastic package. pnp complement: pdta143tmb. 1.2 features and benefits ? 100 ma output cu rrent capability ? reduces component count ? built-in bias resistors ? reduces pick and place costs ? simplifies circuit design ? aec-q101 qualified ? leadless ultra small smd plastic package ? low package height of 0.37 mm 1.3 applications ? low-current peripheral driver ? control of ic inputs ? replaces general-purpose transistors in digital applications ? mobile applications 1.4 quick reference data pdtc143tmb npn resistor-equipped tr ansistor; r1 = 4.7 k ? , r2 = open rev. 2 ? 4 may 2012 product data sheet sot883b table 1. quick reference data symbol parameter conditions min typ max unit v ceo collector-emitter voltage open base - - 50 v i o output current - - 100 ma r1 bias resistor 1 (input) t amb = 25 c 3.3 4.7 6.1 k ?
pdtc143tmb all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 4 may 2012 2 of 11 nxp semiconductors pdtc143tmb npn resistor-equipped transistor; r1 = 4.7 k ? , r2 = open 2. pinning information 3. ordering information 4. marking table 2. pinning information pin symbol description simplified outline graphic symbol 1 i input (base) sot883b (dfn1006b-3) 2 g gnd (emitter) 3 o output (collector) 3 1 2 transparent top view sym012 3 2 1 r1 table 3. ordering information type number package name description version pdtc143tmb dfn1006b-3 leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm sot883b table 4. marking codes type number marking code pdtc143tmb 0011 1011 fig 1. dfn1006b-3 (sot883b) binary marking code description marking code (example) pin 1 indication reading direction reading direction reading example: 0111 1011 006aac673
pdtc143tmb all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 4 may 2012 3 of 11 nxp semiconductors pdtc143tmb npn resistor-equipped transistor; r1 = 4.7 k ? , r2 = open 5. limiting values [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. table 5. limiting values in accordance with the absolute maxi mum rating system (iec 60134). symbol parameter conditions min max unit v cbo collector-base voltage open emitter - 50 v v ceo collector-emitter voltage open base - 50 v v ebo emitter-base voltage open collector - 5 v i o output current - 100 ma i cm peak collector current pulsed; t p 1 ms - 100 ma p tot total power dissipation t amb 25 c [1] - 250 mw t j junction temperature - 150 c t amb ambient temperature -65 150 c t stg storage temperature -65 150 c fr4 pcb, standard footprint fig 2. power derating curve for dfn1006b-3 (sot883b) t amb (c) -75 175 125 25 75 -25 006aad009 100 200 300 p tot (mw) 0
pdtc143tmb all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 4 may 2012 4 of 11 nxp semiconductors pdtc143tmb npn resistor-equipped transistor; r1 = 4.7 k ? , r2 = open 6. thermal characteristics [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. 7. characteristics [1] characteristics of built-in transistor. table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] - - 500 k/w fr4 pcb, standard footprint fig 3. transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aab603 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 10 2 10 10 3 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 table 7. characteristics symbol parameter conditions min typ max unit i cbo collector-base cut-off current v cb =50v; i e =0a; t amb = 25 c - - 100 na i ceo collector-emitter cut-off current v ce =30v; i b =0a; t amb =25c --1a v ce =30v; i b =0a; t j =150c --5a i ebo emitter-base cut-off current v eb =5v; i c =0a; t amb = 25 c - - 100 na h fe dc current gain v ce =5v; i c =1ma; t amb = 25 c 200 - - v cesat collector-emitter saturation voltage i c =5ma; i b =0.25ma; t amb = 25 c - - 100 mv r1 bias resistor 1 (input) t amb = 25 c 3.3 4.7 6.1 k ? c c collector capacitance v cb =10v; i e =0a; i e =0a; f=1mhz; t amb =25c --2.5pf f t transition frequency v ce =5v; i c =10ma; f=100mhz; t amb =25c [1] - 230 - mhz
pdtc143tmb all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 4 may 2012 5 of 11 nxp semiconductors pdtc143tmb npn resistor-equipped transistor; r1 = 4.7 k ? , r2 = open v ce = 5 v (1) t amb = 100 c (2) t amb = 25 c (3) t amb = -40 c i c /i b = 20 (1) t amb = 100 c (2) t amb = 25 c (3) t amb = -40 c fig 4. dc current gain as a function of collector current; typical values fig 5. collector-emitter saturation voltage as a function of collector current; typical values f = 1 mhz; t amb = 25 c v ce = 5 v; t amb = 25 c fig 6. collector capacitance as a function of collector-base voltage; ty pical values of built-in transistor fig 7. transition frequency as a function of collector current; typical values of built-in transistor 006aad070 i c (a) 10 -1 10 2 10 1 10 2 10 3 h fe 10 (1) (2) (3) 006aad071 i c (ma) 10 -1 10 2 10 1 10 -1 1 v cesat (v) 10 -2 (1) (2) (3) v cb (v) 050 40 20 30 10 006aad055 1 2 3 c c (pf) 0 006aac757 i c (ma) 10 -1 10 2 10 1 10 2 10 3 f t (mhz) 10
pdtc143tmb all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 4 may 2012 6 of 11 nxp semiconductors pdtc143tmb npn resistor-equipped transistor; r1 = 4.7 k ? , r2 = open 8. test information 8.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualific ation for discrete semiconductors, and is suitable for use in automotive applications. 9. package outline fig 8. package outline sot883b (dfn1006b-3) 11-11-02 dimensions in mm 2 3 0.55 0.47 0.30 0.22 1 0.40 0.34 0.30 0.22 0.20 0.12 0.65 0.04 max 0.35 0.65 0.55 1.05 0.95
pdtc143tmb all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 4 may 2012 7 of 11 nxp semiconductors pdtc143tmb npn resistor-equipped transistor; r1 = 4.7 k ? , r2 = open 10. soldering fig 9. reflow soldering footprint for sot883b (dfn1006b-3) 1.3 0.3 0.6 0.7 0.4 0.9 0.3 (2x) 0.4 (2x) 0.25 (2x) r0.05 (8x) 0.7 footprint information for reflow soldering sot883b sot883b_fr occupied area solder land solder resist solder land plus solder paste solder paste deposit dimensions in mm
pdtc143tmb all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 4 may 2012 8 of 11 nxp semiconductors pdtc143tmb npn resistor-equipped transistor; r1 = 4.7 k ? , r2 = open 11. revision history table 8. revision history document id release date data sheet status change notice supersedes pdtc143tmb v.2 20120504 product data sheet - pdtc143tmb v.1 modifications: ? 7 ? characteristics ? : parameter name corrected pdtc143tmb v.1 20120425 product data sheet - -
pdtc143tmb all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 4 may 2012 9 of 11 nxp semiconductors pdtc143tmb npn resistor-equipped transistor; r1 = 4.7 k ? , r2 = open 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term 'short data sheet' is explained in section "definitions". [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple de vices. the latest product status information is available on the internet at urlhttp://www.nxp.com . 12.2 definitions preview ? the document is a preview version only. the document is still subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any re presentations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. draft ? the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and r eplaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qualified for use in automotive applications. unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the document status [1] [2] product status [3] definition objective [short] data sheet development this document contai ns data from the objective spec ification for product developmen t. preliminary [short] data sheet qua lification this document contains data from the preliminary specification. product [short] data sheet production this doc ument contains the pr oduct specification.
pdtc143tmb all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 2 ? 4 may 2012 10 of 11 nxp semiconductors pdtc143tmb npn resistor-equipped transistor; r1 = 4.7 k ? , r2 = open characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms an d conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any licens e under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulati ons. export might require a prior authorization from competent authorities. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. adelante , bitport , bitsound , coolflux , coreuse , desfire , ez-hv , fabkey, g reenchip , hipersmart , hitag , i2c-bus logo, icode , i-code , itec , labelution , mifare , mifare plus , mifare ultralight , moreuse , qlpak , silicon tuner , siliconmax , smartxa , starplug , topfet , trenchmos , trimedia and ucode ? are trademarks of nxp b.v. hd radio and hd radio logo ? are trademarks of ibiquity digital corporation. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors pdtc143tmb npn resistor-equipped transistor; r1 = 4.7 k ? , r2 = open ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 4 may 2012 document identifier: pdtc143tmb please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 general description . . . . . . . . . . . . . . . . . . . . . .1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 6 thermal characteristics . . . . . . . . . . . . . . . . . . .4 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .4 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . .6 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . .6 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . .6 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . .8 12 legal information. . . . . . . . . . . . . . . . . . . . . . . . .9 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . .9 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10 13 contact information. . . . . . . . . . . . . . . . . . . . . .10

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